Description

Pin Count: 8

Mounting Style: Through-hole or Surface Mount Device (SMD), depending on application requirements.

Material: High-quality, durable materials to ensure mechanical strength and reliability in various operating conditions.

Contact Material: Phosphor Bronze or Beryllium Copper for excellent electrical conductivity and resistance to corrosion.

Contact Plating: Gold or Tin plating options to maintain a secure and low-resistance connection.

Pitch: Standard pitch to accommodate 8-pin IC packages with precision.

Socket Body: Robust design for mechanical stability and ease of handling during insertion and extraction of ICs.

Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation between pins.

Operating Temperature Range: Suitable for a wide temperature range to meet diverse application requirements.

Current Rating: Adequate current-carrying capacity to handle the specified ICs.

RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) directives for environmental safety.

Package Dimensions: Precise dimensions to accommodate the specified 8-pin IC package size and configuration.

Insertion and Extraction Force: Optimized for easy insertion and removal of ICs while maintaining a secure connection.

Durability: Designed for a high number of insertion and extraction cycles to ensure long-term reliability.

Application: Suitable for use in various electronic circuits, prototyping boards, and test setups where 8-pin ICs are employed.

Compatibility: Compatible with a range of 8-pin ICs from different manufacturers, offering versatility in circuit designs.